Production method for semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate

Reexamination Certificate

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C438S502000, C438S509000

Reexamination Certificate

active

10488243

ABSTRACT:
A method of manufacturing a semiconductor device that provides a semiconductor device having improved channel mobility includes a process of forming a gate insulation film of silicon oxide film, silicon nitride film or silicon oxide nitride film or the like on a silicon oxide substrate, and following formation of the gate insulation film on the silicon oxide substrate with heat treatment for a given time at a temperature range of 900° C. to 1000° C. in an atmosphere containing not less than 25% H2O (water).

REFERENCES:
patent: 5972801 (1999-10-01), Lipkin et al.
patent: 6136727 (2000-10-01), Ueno
patent: 6265326 (2001-07-01), Ueno
patent: 6365233 (2002-04-01), Corman et al.
patent: 6764963 (2004-07-01), Fukuda et al.
patent: 6812102 (2004-11-01), Fukuda et al.
patent: 2002/0043691 (2002-04-01), Higashi et al.
patent: 11-031691 (1999-02-01), None
patent: 11-31691 (1999-02-01), None
patent: 97/17730 (1997-05-01), None
Katsunori Ueno, et al. “H2surface treatment for gate-oxidation of SiC metal-oxide-semiconductor field effect transisitsors”, Materials Science and Engineering, vol. B61-B62, pp. 472-474 1999.
J.A. Cooper, et al., “SiC power electronic devices, MOSFETs and Rectifiers”, Mat. Res.Soc. Symp. Proc., vol. 572, pp. 3-14 1999.
G.Y. Chung, “Improved inversion channel mobility for 4H-SiC MOSFETs fellowing high tempertaure anneals in nitric oside”, IEEE Electron Device Letters, vol. 22, No. 4, pp. 176-178 2001.
L.A. Lipkin et al., Improved Oxidation Procedures for Reduced Si02/Sic Defects, Journal of Electronic Materials, 1996, vol. 25, No. 5, pp. 909 to 915.
L.A. Lipkin et al., Low Interface State Density Oxides on P-Type SiC, Materials Science Forum, 1998, vols. 264 to 268, pp. 853 to 856.

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