Enhancement of copper line reliability using thin ALD tan...

Details Enhancement of copper line reliability using thin ALD tan... Enhancement of copper line reliability using thin ALD tan...

2007-08-28

2007-08-28

Fourson, George R. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S652000, C438S687000, C438S618000, C257S750000, C257S751000, C257SE21579

Reexamination Certificate

active

10741824

ABSTRACT:
A method for depositing a cap layer over a metal-containing interconnect is provided. In one aspect, the cap layer is formed by introducing a pulse of a metal-containing compound followed by a pulse of a nitrogen-containing compound. In one aspect, the cap layer comprises tantalum nitride. The cap layer provides good barrier and adhesive properties, thereby enhancing the electrical performance and reliability of the interconnect.

REFERENCES:
patent: 4058430 (1977-11-01), Suntola et al.
patent: 4389973 (1983-06-01), Suntola et al.
patent: 4413022 (1983-11-01), Suntola et al.
patent: 4486487 (1984-12-01), Skarp
patent: 4767494 (1988-08-01), Kobayashi et al.
patent: 4806321 (1989-02-01), Nishizawa et al.
patent: 4813846 (1989-03-01), Helms
patent: 4829022 (1989-05-01), Kobayashi et al.
patent: 4834831 (1989-05-01), Nishizawa et al.
patent: 4838983 (1989-06-01), Schumaker et al.
patent: 4838993 (1989-06-01), Aoki et al.
patent: 4840921 (1989-06-01), Matsumoto
patent: 4845049 (1989-07-01), Sunakawa
patent: 4859307 (1989-08-01), Nishizawa et al.
patent: 4859627 (1989-08-01), Sunakawa
patent: 4861417 (1989-08-01), Mochizuki et al.
patent: 4876218 (1989-10-01), Pessa et al.
patent: 4917556 (1990-04-01), Stark et al.
patent: 4927670 (1990-05-01), Erbil
patent: 4931132 (1990-06-01), Aspnes et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4960720 (1990-10-01), Shimbo
patent: 4975252 (1990-12-01), Nishizawa et al.
patent: 4993357 (1991-02-01), Scholz
patent: 5000113 (1991-03-01), Wang et al.
patent: 5013683 (1991-05-01), Petroff et al.
patent: 5028565 (1991-07-01), Chang et al.
patent: 5082798 (1992-01-01), Arimoto
patent: 5085885 (1992-02-01), Foley et al.
patent: 5091320 (1992-02-01), Aspnes et al.
patent: 5130269 (1992-07-01), Kitahara et al.
patent: 5166092 (1992-11-01), Mochizuki et al.
patent: 5173474 (1992-12-01), Connell et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5205077 (1993-04-01), Wittstock
patent: 5225366 (1993-07-01), Yoder
patent: 5234561 (1993-08-01), Randhawa et al.
patent: 5246536 (1993-09-01), Nishizawa et al.
patent: 5250148 (1993-10-01), Nishizawa et al.
patent: 5254207 (1993-10-01), Nishizawa et al.
patent: 5256244 (1993-10-01), Ackerman
patent: 5259881 (1993-11-01), Edwards et al.
patent: 5270247 (1993-12-01), Sakuma et al.
patent: 5278435 (1994-01-01), Van Hove et al.
patent: 5281274 (1994-01-01), Yoder
patent: 5286296 (1994-02-01), Sato et al.
patent: 5290609 (1994-03-01), Horiike et al.
patent: 5290748 (1994-03-01), Knuuttila et al.
patent: 5294286 (1994-03-01), Nishizawa et al.
patent: 5296403 (1994-03-01), Nishizawa et al.
patent: 5300186 (1994-04-01), Kitahara et al.
patent: 5306666 (1994-04-01), Izumi
patent: 5311055 (1994-05-01), Goodman et al.
patent: 5316615 (1994-05-01), Copel
patent: 5316793 (1994-05-01), Wallace et al.
patent: 5330610 (1994-07-01), Eres et al.
patent: 5336324 (1994-08-01), Stall et al.
patent: 5338389 (1994-08-01), Nishizawa et al.
patent: 5348911 (1994-09-01), Jurgensen et al.
patent: 5374570 (1994-12-01), Nasu et al.
patent: 5395791 (1995-03-01), Cheng et al.
patent: 5438952 (1995-08-01), Otsuka
patent: 5439876 (1995-08-01), Graf et al.
patent: 5441703 (1995-08-01), Jurgensen
patent: 5443033 (1995-08-01), Nishizawa et al.
patent: 5443647 (1995-08-01), Aucoin et al.
patent: 5455072 (1995-10-01), Bension et al.
patent: 5458084 (1995-10-01), Thorne et al.
patent: 5469806 (1995-11-01), Mochizuki et al.
patent: 5480818 (1996-01-01), Matsumoto et al.
patent: 5483919 (1996-01-01), Yokoyama et al.
patent: 5484664 (1996-01-01), Kitahara et al.
patent: 5503875 (1996-04-01), Imai et al.
patent: 5521126 (1996-05-01), Okamura et al.
patent: 5526244 (1996-06-01), Bishop
patent: 5527733 (1996-06-01), Nishizawa et al.
patent: 5532511 (1996-07-01), Nishizawa et al.
patent: 5540783 (1996-07-01), Eres et al.
patent: 5580380 (1996-12-01), Liu et al.
patent: 5601651 (1997-02-01), Watabe
patent: 5609689 (1997-03-01), Kato et al.
patent: 5616181 (1997-04-01), Yamamoto et al.
patent: 5637530 (1997-06-01), Gaines et al.
patent: 5641984 (1997-06-01), Aftergut et al.
patent: 5644128 (1997-07-01), Wollnik et al.
patent: 5667592 (1997-09-01), Boitnott et al.
patent: 5674786 (1997-10-01), Turner et al.
patent: 5693139 (1997-12-01), Nishizawa et al.
patent: 5695564 (1997-12-01), Imahashi
patent: 5705224 (1998-01-01), Murota et al.
patent: 5707880 (1998-01-01), Aftergut et al.
patent: 5711811 (1998-01-01), Suntola et al.
patent: 5730801 (1998-03-01), Tepman et al.
patent: 5730802 (1998-03-01), Ishizumi et al.
patent: 5747113 (1998-05-01), Tsai
patent: 5749974 (1998-05-01), Habuka et al.
patent: 5788447 (1998-08-01), Yonemitsu et al.
patent: 5788799 (1998-08-01), Steger et al.
patent: 5796116 (1998-08-01), Nakata et al.
patent: 5801634 (1998-09-01), Young et al.
patent: 5804488 (1998-09-01), Shih et al.
patent: 5807792 (1998-09-01), Ilg et al.
patent: 5830270 (1998-11-01), McKee et al.
patent: 5835677 (1998-11-01), Li et al.
patent: 5851849 (1998-12-01), Comizzoli et al.
patent: 5855675 (1999-01-01), Doering et al.
patent: 5855680 (1999-01-01), Soininen et al.
patent: 5856219 (1999-01-01), Naito et al.
patent: 5858102 (1999-01-01), Tsai
patent: 5866213 (1999-02-01), Foster et al.
patent: 5866795 (1999-02-01), Wang et al.
patent: 5879459 (1999-03-01), Gadgil et al.
patent: 5882165 (1999-03-01), Maydan et al.
patent: 5882413 (1999-03-01), Beaulieu et al.
patent: 5916365 (1999-06-01), Sherman
patent: 5923056 (1999-07-01), Lee et al.
patent: 5923985 (1999-07-01), Aoki et al.
patent: 5925574 (1999-07-01), Aoki et al.
patent: 5928389 (1999-07-01), Jevtic
patent: 5942040 (1999-08-01), Kim et al.
patent: 5947710 (1999-09-01), Cooper et al.
patent: 5972430 (1999-10-01), DiMeo, Jr. et al.
patent: 6001669 (1999-12-01), Gaines et al.
patent: 6013553 (2000-01-01), Wallace et al.
patent: 6015590 (2000-01-01), Suntola et al.
patent: 6015917 (2000-01-01), Bhandari et al.
patent: 6020243 (2000-02-01), Wallace et al.
patent: 6025627 (2000-02-01), Forbes et al.
patent: 6036773 (2000-03-01), Wang et al.
patent: 6037664 (2000-03-01), Zhao et al.
patent: 6042652 (2000-03-01), Hyun et al.
patent: 6043177 (2000-03-01), Falconer et al.
patent: 6051286 (2000-04-01), Zhao et al.
patent: 6062798 (2000-05-01), Muka
patent: 6071808 (2000-06-01), Merchant et al.
patent: 6084302 (2000-07-01), Sandhu
patent: 6086677 (2000-07-01), Umotoy et al.
patent: 6110556 (2000-08-01), Bang et al.
patent: 6113771 (2000-09-01), Landau et al.
patent: 6113977 (2000-09-01), Soininen et al.
patent: 6117244 (2000-09-01), Bang et al.
patent: 6124158 (2000-09-01), Dautartas et al.
patent: 6130147 (2000-10-01), Major et al.
patent: 6139700 (2000-10-01), Kang et al.
patent: 6140237 (2000-10-01), Chan et al.
patent: 6140238 (2000-10-01), Kitch
patent: 6143659 (2000-11-01), Leem
patent: 6144060 (2000-11-01), Park et al.
patent: 6158446 (2000-12-01), Mohindra et al.
patent: 6169028 (2001-01-01), Wang et al.
patent: 6174377 (2001-01-01), Doering et al.
patent: 6174809 (2001-01-01), Kang et al.
patent: 6174812 (2001-01-01), Hsiung et al.
patent: 6197678 (2001-03-01), Yu
patent: 6197683 (2001-03-01), Kang et al.
patent: 6200893 (2001-03-01), Sneh
patent: 6203613 (2001-03-01), Gates et al.
patent: 6204168 (2001-03-01), Naik et al.
patent: 6206967 (2001-03-01), Mak et al.
patent: 6207302 (2001-03-01), Sugiura et al.
patent: 6207487 (2001-03-01), Kim et al.
patent: 6218298 (2001-04-01), Hoinkis
patent: 6238734 (2001-05-01), Senzaki et al.
patent: 6248605 (2001-06-01), Harkonen et al.
patent: 6258713 (2001-07-01), Yu et al.
patent: 6270572 (2001-08-01), Kim et al.
patent: 6271148 (2001-08-01), Kao et al.
patent: 6284646 (2001-09-01), Leem
patent: 6287965 (2001-09-01), Kang et al.
patent: 6291283 (2001-09-01), Wilk
patent: 6291876 (2001-09-01), Stumborg et al.
patent: 6299294 (2001-10-01), Regan
patent: 6305314 (2001-10-01), Sneh et al.
patent: 6306216 (2001-10-01), Kim et al.
patent: 6316098 (2001-11-01), Yitzchaik et al.
patent: 6333260 (2001-12-01), Kwon et al.
patent: 6335280 (2002-01-01), van der Jeugh
patent: 6342277 (2002-01-01), Sherman
patent: 6348376 (2002-02-01), Lim et al.
patent: 6348386 (2002

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