Stackable ceramic FBGA for high thermal applications

Details Stackable ceramic FBGA for high thermal applications Stackable ceramic FBGA for high thermal applications

2007-10-23

2007-10-23

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S112000

Reexamination Certificate

active

11063403

ABSTRACT:
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

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