Methods of reducing floating body effect

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S272000, C438S268000, C438S283000, C257S330000, C257S296000, C257S302000, C257SE21410, C257SE29262

Reexamination Certificate

active

11437999

ABSTRACT:
Methods of reducing the floating body effect in vertical transistors are disclosed. The floating body effect occurs when an active region in a pillar is cut off from the substrate by a depletion region and the accompanying electrostatic potential created. In a preferred embodiment, a word line is recessed into the substrate to tie the upper active region to the substrate. The resulting memory cells are preferably used in dynamic random access memory (DRAM) devices.

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