Semiconductor device having a recess gate for improved...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S303000, C438S305000, C438S306000, C438S524000, C438S525000, C438S527000, C438S700000

Reexamination Certificate

active

11287594

ABSTRACT:
A semiconductor device having a recess gate is formed by first forming a recess below the upper surface of the substrate. A spacer is formed at each sidewall of the recess. An impurity doping area is formed in a source area. A first LDD area is formed in a drain area. A gate comprising a gate insulating layer and a gate conductive layer is then formed in the recess. A second LDD area is formed on the upper surface of the semiconductor substrate. A gate spacer is formed at each sidewall of the gate. Then a source/drain area having an asymmetrical structure is formed on each side of the gate.

REFERENCES:
patent: 5021355 (1991-06-01), Dhong et al.
patent: 6252277 (2001-06-01), Chan et al.
patent: 2001/0039092 (2001-11-01), Morimoto et al.
patent: 2005/0205897 (2005-09-01), Depetro et al.
patent: 2006/0284225 (2006-12-01), Popp et al.
patent: 2006/0286757 (2006-12-01), Power et al.
patent: 1992-0022518 (1992-12-01), None
patent: 1019940002400 (1994-03-01), None
patent: 100137811 (1998-02-01), None
Korean Patent Gazette, Jan. 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having a recess gate for improved... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a recess gate for improved..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a recess gate for improved... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3834025

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.