Method of manufacturing a semiconductor integrated circuit...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S199000, C438S301000

Reexamination Certificate

active

10766587

ABSTRACT:
A semiconductor integrated circuit has a CMOS transistor formed on a first conductivity type semiconductor film provided on a first conductivity type supporting substrate through an embedded insulating film. Thermal oxidation is conducted to form a LOCOS for element separation between transistors in the semiconductor film. A gate oxide film of a second conductivity type transistor is formed over the insulating film. A first conductivity type impurity region is formed between the gate oxide film and the embedded insulating film in a region where the second conductivity type transistor is to be formed. A first conductivity type impurity region having a higher density than that of the first conductivity type impurity region is formed in a middle depth portion of the semiconductor film serving as the proximal region to a drain in the first conductivity type impurity region. A polysilicon film is formed on the gate oxide film and etching the polysilicon film so as to form a gate electrode of the second conductivity type transistor. Ion implantation is performed through the gate electrode so as to form a second conductivity type impurity region in each of a source region and a drain region.

REFERENCES:
patent: 5719425 (1998-02-01), Akram et al.
patent: 5998274 (1999-12-01), Akram et al.
patent: 6064099 (2000-05-01), Yamada et al.
patent: 6245618 (2001-06-01), An et al.
patent: 6541333 (2003-04-01), Shukuri et al.
patent: 6713325 (2004-03-01), Wake et al.
patent: 2002/0005553 (2002-01-01), Ootsuka et al.
patent: 2002/0051378 (2002-05-01), Ohsawa

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