Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-09
2007-01-09
Clark, Jasmine (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C438S617000, C257S772000, C257S779000, C257S783000, C257S223000, C257SE23023, C257SE21508
Reexamination Certificate
active
11079741
ABSTRACT:
Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads to be used for wire bonding. Bonding pads for wire bonding is shielded by a masking tape. An adhesive layer is applied to the surface of each of pads to be used for flip chip bonding. Solder powder is provided to adhere to the surface of each of pads to be used for flip chip bonding with the adhesive layer. The masking tape is peeled off from the bonding pads for wire bonding. The solder powder is melted by reflowing so that the solder covers the pads to be used for flip chip bonding.
REFERENCES:
patent: 4561191 (1985-12-01), Parkinson
patent: 5586715 (1996-12-01), Schwiebert et al.
patent: 6461953 (2002-10-01), Sakuyama et al.
patent: 6548898 (2003-04-01), Matsuki et al.
patent: 6781221 (2004-08-01), Yoneda
patent: 7-7244 (1995-01-01), None
Clark Jasmine
Rankin, Hill Porter & Clark LLP
Shinko Electric Industries Co. Ltd.
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