Manufacturing method of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S151000, C438S241000, C438S258000, C438S283000, C257S270000, C257S750000

Reexamination Certificate

active

11284184

ABSTRACT:
A manufacturing method of a semiconductor device disclosed herein comprises: forming a first protrusion; forming a second protrusion which is higher than the first protrusion; forming a first sidewall on a side surface of the second protrusion; forming a first film so that a surface of the first film is located lower than the second protrusion; forming a mask on a side surface of the first sidewall on a side surface of the second protrusion which protrudes from the surface of the first film; and etching the first film with the mask so as to form a second sidewall on the side surface of the first sidewall on the side surface of the second protrusion but not to form the second sidewall on a side surface of the first protrusion, the second sidewall being formed of the mask and the first film.

REFERENCES:
patent: 5554888 (1996-09-01), Kato
patent: 5804848 (1998-09-01), Mukai
patent: 2005/0202618 (2005-09-01), Yagishita
patent: 2005/0202678 (2005-09-01), Abrams et al.
patent: 2002-009289 (2002-01-01), None
patent: 2005-294789 (2005-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing method of semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3810091

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.