Method and apparatus for improved power routing

Details Method and apparatus for improved power routing Method and apparatus for improved power routing

Filed on

2007-04-24

Date issued

2007-04-24

Examiner

Whitehead, Jr., Carl (Department: 2813)

Patent Class

Semiconductor device manufacturing: process

SubClass

Coating with electrically or thermally conductive material

SubSubClass

To form ohmic contact to semiconductive material

Other Related Categories

C438S108000, C438S622000, C438S623000, C438S624000, C438S625000, C438S626000, C438S627000, C438S628000, C438S629000, C438S613000, C257S757000, C257S772000, C257S777000, C257S778000, C257S779000, C257S780000

Type

Reexamination Certificate

Status

active

Patent number

11144974

Description

ABSTRACT:
An apparatus comprising: a die having a top metal layer, the top metal layer comprised of at least a first metal line and a second metal line; a passivation layer covering the top metal layer; a C4 bump on the passivation layer; and a first passivation opening and a second passivation opening in the passivation layer, the first passivation opening to connect the first metal line to the C4 bump, and the second passivation opening to connect the second metal line to the C4 bump.

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