Trench capacitor with buried strap

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S244000, C438S245000, C438S246000, C438S241000, C257SE21651

Reexamination Certificate

active

11053508

ABSTRACT:
A trench capacitor with improved strap is disclosed. The strap is located above the top surface of the capacitor. The top surface of the trench capacitor, which is formed by the top surfaces of the collar and storage plate, is planar. By locating the strap on a planar surface, the divot present in conventional strap processes is avoided. This results in improved strap reliability and device performance.

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Radens, C.J., et al., “A 0.135 μm26F2Trench-Sidewall Vertical Device Cell for 4Gb/16Gb DRAM,” 2000 Symposium on VLSI Technology Digest of Technical Papers, pp. 80-81.
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