Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-01-30
2007-01-30
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S240000, C438S386000, C257S296000, C257S301000, C257SE21008
Reexamination Certificate
active
11100508
ABSTRACT:
A method of manufacturing a semiconductor device, includes the steps of: (a) forming a first inter-level insulating film on a semiconductor substrate formed with semiconductor elements; (b) forming a contact hole through the first inter-level insulating film; (c) forming a plug made of conductive material capable of being nitrided, the plug being embedded in the contact hole; and (d) heating the semiconductor substrate in a nitriding atmosphere to nitride the plug from a surface thereof. This semiconductor device manufacture method can prevent breakdown of a plug when a capacitor is formed on the plug.
REFERENCES:
patent: 5185282 (1993-02-01), Lee et al.
patent: 5481127 (1996-01-01), Ogawa
patent: 5530279 (1996-06-01), Yamamichi et al.
patent: 5567243 (1996-10-01), Foster et al.
patent: 5633781 (1997-05-01), Saenger et al.
patent: 5650351 (1997-07-01), Wu
patent: 5780908 (1998-07-01), Sekiguchi et al.
patent: 5828092 (1998-10-01), Tempel
patent: 6046489 (2000-04-01), Yamaguchi
patent: 6054391 (2000-04-01), Nam et al.
patent: 6077450 (2000-06-01), Lee
patent: 6077741 (2000-06-01), Chu
patent: 6169009 (2001-01-01), Ju et al.
patent: 6284649 (2001-09-01), Miyamoto
patent: 6287965 (2001-09-01), Kang et al.
patent: 6287975 (2001-09-01), DeOrnellas et al.
patent: 6303426 (2001-10-01), Alers
patent: 6303956 (2001-10-01), Sandhu et al.
patent: 6342425 (2002-01-01), Joo
patent: 6420272 (2002-07-01), Shen et al.
patent: 6448132 (2002-09-01), Takahashi
patent: 6452274 (2002-09-01), Hasegawa et al.
patent: 6602756 (2003-08-01), Lin et al.
patent: 6635523 (2003-10-01), Uchiyama et al.
patent: 6692648 (2004-02-01), Hwang et al.
patent: 09-008253 (1997-01-01), None
patent: 09-266289 (1997-10-01), None
patent: 10-107218 (1998-04-01), None
patent: 10-173152 (1998-06-01), None
patent: 2000-183299 (2000-06-01), None
patent: 2001-210798 (2001-08-01), None
Japanese Office Action mailed on May 16, 2006, issued in corresponding Japanese patent application No. 2000-255708.
Fujitsu Limited
Picardat Kevin M.
Westerman, Hattori, Daniels & Adrian , LLP.
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