Circuit structures and methods of forming circuit structures...

Details Circuit structures and methods of forming circuit structures... Circuit structures and methods of forming circuit structures...

2007-07-03

2007-07-03

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S499000, C257SE23117, C438S107000

Reexamination Certificate

active

11376795

ABSTRACT:
An apparatus including a contact point formed on a device layer of a circuit substrate or an interconnect layer on the substrate; a first dielectric material; and a different second polymerizable dielectric material on the substrate and separated from the device layer or the interconnect layer by the first dielectric material following polymerization, the second dielectric material comprising a glass transition temperature of at least 250° C. and a thermal decomposition temperature of at least 400° C. A method including depositing a dielectric material and thermally treating the dielectric material at a temperature greater than the thermal decomposition temperature.

REFERENCES:
patent: 4623577 (1986-11-01), Hsiue et al.
patent: 5358992 (1994-10-01), Dershem et al.
patent: 5501755 (1996-03-01), Dahlquist
patent: 5718941 (1998-02-01), Dershem et al.
patent: 5858869 (1999-01-01), Chen et al.
patent: 5887345 (1999-03-01), Kulesza et al.
patent: 6093636 (2000-07-01), Carter et al.
patent: 6198284 (2001-03-01), Doty
patent: 6660618 (2003-12-01), Chen et al.
patent: 6663946 (2003-12-01), Seri et al.
patent: 6824642 (2004-11-01), Walter et al.
patent: 2002/0195687 (2002-12-01), Brooks et al.
patent: 2003/0176616 (2003-09-01), Bauer et al.
patent: 2004/0195967 (2004-10-01), Padiyath et al.

Affiliated with

Also associated with

Rating

Circuit structures and methods of forming circuit structures... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit structures and methods of forming circuit structures..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit structures and methods of forming circuit structures... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3776844