Metrology for chemical mechanical polishing

Details Metrology for chemical mechanical polishing Metrology for chemical mechanical polishing

2007-03-27

2007-03-27

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S288000

Reexamination Certificate

active

11187612

ABSTRACT:
Methods and apparatus for providing metrology for chemical mechanical polishing. A chemical mechanical polishing system includes a first polishing station, a second polishing station, a transport device, and a first measuring station. The transport device is configured to hold a workpiece during polishing at the first and second polishing stations and to move the workpiece from the first polishing station to the second polishing station. The first measuring station is situated to measure a characteristic of the workpiece when the transport device is holding the workpiece and when the workpiece is not in contact with a polishing pad of any of the first polishing station and the second polishing station.

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