Micro-mechanically strained semiconductor film

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S401000

Reexamination Certificate

active

11210927

ABSTRACT:
One aspect of the present subject matter relates to a method for forming strained semiconductor film. In various embodiments, a single crystalline semiconductor film is formed on a substrate surface, and a recess is created beneath the film. A portion of the film is influenced into the void and strained. In various embodiments, the naturally-occurring Van der Waal's force is sufficient to influence the film into the void. In various embodiments, a nano-imprint mask is used to assist with influencing the film into the void. In various embodiments, an oxide region is formed in a silicon substrate, and a single crystalline silicon film is formed on the semiconductor substrate and on at least a portion of the oxide region. The oxide region is removed allowing the Van der Waal's force to bond the film to the silicon substrate. Other aspects are provided herein.

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