Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-09-11
2007-09-11
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S244000, C438S253000, C257SE21008
Reexamination Certificate
active
10999977
ABSTRACT:
A semiconductor device includes: a conductive plug formed through an insulating film; a conductive oxygen barrier film formed on the insulating film so as to be electrically connected to the conductive plug and to cover the conductive plug; a lower electrode formed on the oxygen barrier film and connected to the oxygen barrier film; a capacitive insulating film formed on the lower electrode, following the lower electrode; and an upper electrode formed on the capacitive insulating film, following the capacitive insulating film. The capacitive insulating film has a bent portion that extends along the direction in which the conductive plug penetrates through the insulating film.
REFERENCES:
patent: 6004856 (1999-12-01), Mazure-Espejo et al.
patent: 6040215 (2000-03-01), Takaishi
patent: 6177284 (2001-01-01), Horii et al.
patent: 6180447 (2001-01-01), Park et al.
patent: 6232174 (2001-05-01), Nagata et al.
patent: 6239461 (2001-05-01), Lee
patent: 6284595 (2001-09-01), Kato
patent: 6297527 (2001-10-01), Agarwal et al.
patent: 6335241 (2002-01-01), Hieda et al.
patent: 6421223 (2002-07-01), Marsh
patent: 6599806 (2003-07-01), Lee
patent: 6660580 (2003-12-01), Lee
patent: 6682969 (2004-01-01), Basceri et al.
patent: 2002/0037624 (2002-03-01), Mori et al.
patent: 2002/0061604 (2002-05-01), Sitaram et al.
patent: 2002/0102791 (2002-08-01), Karusawa et al.
patent: 2002/0165615 (2002-11-01), Abouaf et al.
patent: 09-331038 (1997-12-01), None
patent: 11-265984 (1999-09-01), None
patent: 11-307735 (1999-11-01), None
patent: 2000-22109 (2000-01-01), None
patent: 2000-68471 (2000-03-01), None
patent: 2000-124426 (2000-04-01), None
patent: 2000-216362 (2000-08-01), None
patent: 2000-228506 (2000-08-01), None
patent: 2000-315779 (2000-11-01), None
patent: 2001-77326 (2001-03-01), None
patent: 2001-85640 (2001-03-01), None
patent: 2001-223345 (2001-08-01), None
patent: 2001-250925 (2001-09-01), None
patent: 2001-267535 (2001-09-01), None
patent: 2002-9259 (2002-01-01), None
patent: 2002-57299 (2002-02-01), None
patent: 2002-57306 (2002-02-01), None
patent: 2002-76290 (2002-03-01), None
patent: 2002-76293 (2002-03-01), None
patent: WO 01/84605 (2001-09-01), None
Notice of Reasons for Rejection, dated Jun. 6, 2006 of 2004-031024, 9 pages.
Fujii Eiji
Ito Toyoji
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Trinh Michael
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