Process for producing integrated circuits including...

Details Process for producing integrated circuits including... Process for producing integrated circuits including...

2007-07-10

2007-07-10

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S658000, C438S686000, C438S687000, C438S508000, C257S044000, C257SE21202

Reexamination Certificate

active

11110345

ABSTRACT:
This invention concerns a process for producing integrated circuits containing at least one layer of elemental metal which during the processing of the integrated circuit is at least partly in the form of metal oxide, and the use of an organic compound containing certain functional groups for the reduction of a metal oxide layer formed during the production of an integrated circuit. According to the present process the metal oxide layer is at least partly reduced to elemental metal with a reducing agent selected from organic compounds containing one or more of the following functional groups: alcohol (—OH), aldehyde (—CHO), and carboxylic acid (—COOH).

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