Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2007-04-24
2007-04-24
Kackar, Ram N. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C118S715000, C118S716000, C118S717000, C118S718000, C118S728000, C118S731000, C118S732000, C118S733000
Reexamination Certificate
active
10875306
ABSTRACT:
The specification discloses a structure and method for measuring the etching speed. A test layer is connected with several resistors. Etching the metal layer disconnects in order the resistors from the circuit. The equivalent resistance of the sensing resistor system is measured to obtain the etching speed. In consideration of the errors of the resistors, the invention also provides a structure that utilizes an IC layout technique to put an interdigitized dummy resistor beside the sensing resistors. By taking the ratio of the equivalent resistance of the sensing resistors and the dummy resistor, the invention can compute to obtain the etching speed.
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Chen Stella Y. H.
Chiou Jing-Hung
Liang Chao-Chiun
Wang Chin-Horng
Yen Kai-Hsiang
Chandra Satish
Industrial Technology Research Institute
Kackar Ram N.
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