Epitaxial semiconductor deposition methods and structures

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S190000

Reexamination Certificate

active

10800390

ABSTRACT:
Methods for depositing epitaxial films such as epitaxial Ge and SiGe films. During cooling from high temperature processing to lower deposition temperatures for Ge-containing layers, Si or Ge compounds are provided to the substrate. Smooth, thin, relatively defect-free Ge or SiGe layers result. Retrograded relaxed SiGe is also provided between a relaxed, high Ge-content seed layer and an overlying strained layer.

REFERENCES:
patent: 5221556 (1993-06-01), Hawkins et al.
patent: 5256550 (1993-10-01), Laderman et al.
patent: 5879970 (1999-03-01), Shiota et al.
patent: 5891769 (1999-04-01), Liaw et al.
patent: 6030894 (2000-02-01), Hada et al.
patent: 6093252 (2000-07-01), Wengert et al.
patent: 6319782 (2001-11-01), Nakabayashi
patent: 6373112 (2002-04-01), Murthy et al.
patent: 6537370 (2003-03-01), Hernandez et al.
patent: 6562736 (2003-05-01), Yanagawa et al.
patent: 6573126 (2003-06-01), Cheng et al.
patent: 6592942 (2003-07-01), Van Wijck
patent: 6633066 (2003-10-01), Bae et al.
patent: 6645836 (2003-11-01), Kanzawa et al.
patent: 6713326 (2004-03-01), Cheng et al.
patent: 6844213 (2005-01-01), Sparks
patent: 6858502 (2005-02-01), Chu et al.
patent: 6875279 (2005-04-01), Chu et al.
patent: 6900115 (2005-05-01), Todd
patent: 6958253 (2005-10-01), Todd
patent: 2002/0173130 (2002-11-01), Pomerede et al.
patent: 2003/0045063 (2003-03-01), Oda
patent: 2003/0082300 (2003-05-01), Todd et al.
patent: 2003/0124818 (2003-07-01), Luo et al.
patent: 2003/0157787 (2003-08-01), Murthy et al.
patent: 2003/0190791 (2003-10-01), Fischetti et al.
patent: 2003/0207127 (2003-11-01), Murthy et al.
patent: 2003/0235931 (2003-12-01), Wada et al.
patent: 2004/0217845 (2004-11-01), Silver et al.
patent: 2004/0219735 (2004-11-01), Brabant et al.
patent: 2005/0079692 (2005-04-01), Samoilov et al.
patent: 2006/0216417 (2006-09-01), Todd et al.
patent: 0 858 101 (1998-02-01), None
patent: WO 00/15885 (2000-03-01), None
patent: WO 01/41544 (2001-06-01), None
Cannon, D. et al., “Tensile strained epitaxial Ge films on Si(100) substrates with potential application in L-band telecommunications,” Applied Physics Letters, vol. 84, No. 6, Feb. 9, 2004, pp. 906-908.
Colace, L. et al., “Efficient high-speed near-infrared Ge photodetectors integrated on Si substrates,” Applied Physics Letters, vol. 76, No. 10, Mar. 6, 2000, pp. 1231-1233.
Colace, L. et al., “Ge-on-Si Approaches to the Detection of Near-Infrared Light,” IEEE Journal of Quantum Electronics, vol. 35, No. 12, Dec. 1999, pp. 1843-1852.
Fama, S. et al., “High performance germanium-on-silicon detectors for optical communications,” Applied Physics Letters, vol. 81, No. 4, Jul. 22, 2002, pp. 586-588..
Hull, R., “Metastable strained layer configurations in the SiGe/Si system,” (1999)EMIS Datareviews, Series No. 24: Properties of SiGe and SiGe:C, edited by Erich Kasper et al., INSPEC (2000), London, UK.
Ishikawa, Y. et al., “Strain-induced band gap shrinkage in Ge grown on Si substrate,” Applied Physics Letters, Vol. 82, No. 12, Mar. 31, 2003, pp. 2044-2046.
Lee et al., “Growth of strained Si and strained Ge heterostructures on relaxed Si1−xGexby ultrahigh vacuum chemical vapor deposition,” J. Vac. Sci. Technol. B 22(1) (Jan./Feb. 2004).
Li, Q, et al., “Selective growth of Ge on Si(100) through vias of SiO2nanotemplate using solid source molecular beam epitaxy,” Applied Physics Letters, vol. 83, No. 24, Dec. 15, 2003, pp. 5032-5034.
Liu, J. et al., “Silicidation—induced band gap shrinkage in Ge epitaxial films on Si,” Applied Physics Letters, vol. 84, No. 5, Feb. 2, 2004, pp. 660-662.
Masini, G. et al.; “High-Performance p-i-n Ge on Si Photodetectors for the Near Infrared: From Model to Domonstration,” IEEE Transactions of Electron Devices, vol. 48, No. 6, Jun. 2001, pp. 1092-1096.
Schollhorn et al., “Coalescence of germanium islands on silicon,” Thin Solid Films, vol. 336 (1988), pp. 109-111.
Bauer et al., “Relaxed SiGe buffers with thicknesses below 0.1 μm”,Thin Solid Films369:152-156 (2000).
Bauer et al., “High Ge content photodetectors on thin SiGe buffers”,Materials Science and EngineeringB89:77-83 (2002).
Bensahel et al., “Single-wafer processing of in-situ doped polycrystalline Si and Si1−xGex”,Solid State Technology, pp. S5-S10 (Mar. 1998).
Chui et al., “Ultrathin high-kgate dielectric technology for germanium MOS applications”,IEEE 60th Annual Device Research Conference(DRC)Digest, paper VII.B2, pp. 191-192 (2002).
Colace et al., “Ge/Si(001) photodetector for near infrared light”,Solid State Phenomena54:55-58 (1997).
Colace et al., “Metal-semiconductor-metal near-infrared light detector based on epitaxial Ge/Si”,Applied Physics Letters72:3175-3177 (1998).
Colace et al., “Metal-Ge-Si diodes for near-infrared light detection”,Journal of Vacuum Science and Technology B17:465 (1999).
Currie et al., “Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing”,Applied Physics Letters72:1718-1720 (1998).
Fischetti et al., “Band structure, deformation potentials, and carrier mobility in strained Si, Ge, and SiGe alloys”,Journal of Applied Physics80:2234-2252 (1996).
Giovane et al., “Correlation between leakage current density and threading dislocation density in SiGe p-i-n diodes grown on relaxed graded buffer layers”,Applied Physics Letters78:541-543 (2001).
Hartmann et al., “Reduced pressure-chemical vapor deposition of Ge thick layers on Si(001) for 1.3-1.55-μm photodetection”,Journal of Applied Physics95:5905-5913 (2004).
Jackson et al., “Gate-Self-Aligned p-Channel Germanium MISFET's”,IEEE Electron Device Letters12:605-607 (1991).
Kasper, “Prospects of SiGe Heterodevices”,Journal of Crystal Growth150:921-925 (1995).
Kasper et al., “New virtual substrate concept for vertical MOS transistors”,Thin Solid Films336:319-322 (1998).
Lee et al., “Strained Ge channel p-type metal-oxide-semiconductor field-effect transistors grown on Si1−xGex/Si virtual substrates”,Applied Physics Letters79:3344-3346 (2001).
Lee et al., “Strained Si/strained Ge dual-channel heterostructures on Relaxed Si0.5Ge0.5for symmetric mobility p-type and n-type metal-oxide-semiconductor field-effect transistors”,Applied Physics Letters83:4202-4204 (2003).
Lee et al., “Electron mobility characteristics of n-channel metal-oxide-semiconductor field-effect transistors fabricated on Ge-rich single—and dual-channel SiGe heterostructures”,Journal of Applied Physics95:1550-1555 (2004).
Letertre et al, “Germanium-on-insulator (GeOI) structure realized by the Smart Cut™ technology”,MRS Proceedings, vol. 809 (2004).
Luan et al., “High-quality Ge epilayers on Si with low threading-dislocation densities”,Applied Physics Letters75:2909-2911 (1999).
Lyutovich et al., “Interaction between point defects and dislocations in SiGe”,Solid State Phenomena69-70:179-184 (1999).
Lyutovich et al., “Relaxed SiGe buffer layer growth with point defect injection”,Materials Science and EngineeringB71:14-19 (2000).
Lyutovich et al., “Thin SiGe buffers with high Ge content forn-MOSFETs”,Materials Science and EngineeringB89:341-345 (2002).
Ni et al., “X-ray reciprocal space mapping studies of strain relaxation in thin SiGe layers (≦100nm) using a low temperature growth step”,Journal of Crystal Growth227-228:756-760 (2001).
Reinking et al., “Ge p-MOSFETs compatible with Si CMOS-technology”,Proceedings of the 29th ESSDERC99:300-303 (1999).
Samavedam et al., “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers”,Applied Physics Letters73:2125-2127 (1998).
Sch&#x

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Epitaxial semiconductor deposition methods and structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epitaxial semiconductor deposition methods and structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epitaxial semiconductor deposition methods and structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3726035

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.