Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2007-04-17
2007-04-17
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C257SE21411
Reexamination Certificate
active
10968093
ABSTRACT:
The present invention is characterized in that gettering is performed such that impurity regions to which a noble gas element is added are formed in a semiconductor film and the metallic element included in the semiconductor film is segregated into the impurity regions by laser annealing. Also, a reflector is provided under a substrate on which a semiconductor film is formed. When laser light transmitted through the semiconductor film substrate is irradiated from the front side of the substrate, the laser beam is reflected by the reflector and thus the laser light can be irradiated to the semiconductor film from the read side thereof. Laser light can be also irradiated to low concentration impurity regions overlapped with a portion the gate electrode. Thus, an effective energy density in the semiconductor film is increased to thereby effect recovery of crystallinity and activation of the impurity element.
REFERENCES:
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5913112 (1999-06-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: RE36314 (1999-09-01), Yamazaki et al.
patent: 5962870 (1999-10-01), Yamazaki et al.
patent: 6285042 (2001-09-01), Ohtani et al.
patent: 6331723 (2001-12-01), Yamazaki et al.
patent: 6426245 (2002-07-01), Kawasaki et al.
patent: 6489222 (2002-12-01), Yoshimoto
patent: 6599788 (2003-07-01), Kawasaki et al.
patent: 6746901 (2004-06-01), Kasahara et al.
patent: 6909114 (2005-06-01), Yamazaki
patent: 2001/0010702 (2001-08-01), Tanaka
patent: 2001/0015441 (2001-08-01), Kawasaki et al.
patent: 2001/0055830 (2001-12-01), Yoshimoto
patent: 2002/0017685 (2002-02-01), Kasahara et al.
patent: 2002/0024047 (2002-02-01), Yamazaki et al.
patent: 2002/0094008 (2002-07-01), Tanaka
patent: 2003/0024905 (2003-02-01), Tanaka
patent: 2003/0086182 (2003-05-01), Tanaka et al.
patent: 2003/0143337 (2003-07-01), Tanaka
patent: 2003/0168437 (2003-09-01), Tanaka
patent: 2005/0054181 (2005-03-01), Nakamura et al.
patent: 2005/0056934 (2005-03-01), Suzawa et al.
patent: 07-183540 (1995-07-01), None
patent: 10-270363 (1998-10-01), None
Specification, Claims, Abstract, and Drawings of U.S. Appl. No. 09/988,389 filed Nov. 19, 2001.
Arai Yasuyuki
Murakami Satoshi
Nakamura Osamu
Ohnuma Hideto
Tanaka Koichiro
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