Plasma processing apparatus and method of plasma processing

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – Having glow discharge electrode gas energizing means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S7230ER

Reexamination Certificate

active

07153387

ABSTRACT:
There is provided a plasma processing system and method capable of decreasing the non-uniformity of a field distribution on the surface of an electrode and making the density of plasma uniform, in a plasma processing using a high density plasma which can cope with a further scale down. First and second electrodes21and5are provided in a chamber so as to face each other. A feeder plate52is arranged so as to be slightly spaced from the opposite surface of a surface serving as a feeding plane of the first electrode facing the second electrode5. A feeder rod51is connected to the feeder plate52at a position which is radially shifted from a position corresponding to the center of the feeding plane of the first electrode21. The feeder plate52is rotated to rotate the feeding position of the feeder rod51on the feeding plane of the first electrode. A high frequency electric power is thus fed to form a high frequency electric field between the first and second electrodes21and5to form plasma to plasma-process a substrate W.

REFERENCES:
patent: 6142096 (2000-11-01), Sakai et al.
patent: 6155202 (2000-12-01), Nakano et al.
patent: 6359250 (2002-03-01), Blonigan et al.
patent: 0 663 682 (1995-07-01), None
patent: 0 930 642 (1999-07-01), None
patent: 3-206613 (1991-09-01), None
patent: 05013343 (1993-01-01), None
patent: 5-29273 (1993-02-01), None
patent: 05198390 (1993-08-01), None
patent: 6-333697 (1994-12-01), None
patent: 10-32171 (1998-02-01), None
patent: WO 00/03415 (2000-01-01), None
PCT Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report (PCT/IB/338) issued for PCT/JP00/05408.
International Preliminary Examination Report (PCT/IPEA/409) (translated) issued for PCT/JP00/05408.
Supplementary European Search Report issued in connection with EP 00 95 1961, dated Nov. 9, 2005.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma processing apparatus and method of plasma processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma processing apparatus and method of plasma processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus and method of plasma processing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3712071

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.