Method of assembling soldered packages utilizing selective...

Details Method of assembling soldered packages utilizing selective... Method of assembling soldered packages utilizing selective...

2006-12-26

2006-12-26

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S798000, C228S180210, C228S180220

Reexamination Certificate

active

07153765

ABSTRACT:
A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder suspension. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes a bump that was reflowed from the nano-sized solder suspension.

REFERENCES:
patent: 4273859 (1981-06-01), Mones et al.
patent: 4661375 (1987-04-01), Thomas
patent: 4950623 (1990-08-01), Dishon
patent: 5877078 (1999-03-01), Yanagida
patent: 04116831 (1992-04-01), None

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