Method of forming a capacitor

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

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Details

C438S253000, C438S255000, C438S398000, C257S303000, C257S306000

Reexamination Certificate

active

07153751

ABSTRACT:
The invention includes a method of forming a semiconductor construction. A semiconductor substrate is provided, and a conductive node is formed to be supported by the semiconductor substrate. A first conductive material is formed over the conductive node and shaped as a container. The container has an opening extending therein and an upper surface proximate the opening. The container opening is at least partially filled with an insulative material. A second conductive material is formed over the at least partially filled container opening and physically against the upper surface of the container. The invention also includes semiconductor structures.

REFERENCES:
patent: 5565708 (1996-10-01), Ohsaki et al.
patent: 5731701 (1998-03-01), Lee et al.
patent: 5837591 (1998-11-01), Shimada et al.
patent: 5950092 (1999-09-01), Figura et al.
patent: 6001420 (1999-12-01), Mosely et al.
patent: 6004857 (1999-12-01), Hsiao et al.
patent: 6017144 (2000-01-01), Guo et al.
patent: 6025652 (2000-02-01), Tsukamoto
patent: 6093615 (2000-07-01), Schuele et al.
patent: 6096595 (2000-08-01), Huang
patent: 6174781 (2001-01-01), Dai et al.
patent: 6248640 (2001-06-01), Nam
patent: 6287935 (2001-09-01), Coursey
patent: 6300216 (2001-10-01), Shan
patent: 6319771 (2001-11-01), Tseng
patent: 6323558 (2001-11-01), Jeong
patent: 6380579 (2002-04-01), Nam et al.
patent: 6461911 (2002-10-01), Ahn et al.
patent: 6472229 (2002-10-01), Aoki et al.
patent: 6492245 (2002-12-01), Liu et al.
patent: 6534357 (2003-03-01), Basceri et al.
patent: 6645811 (2003-11-01), Roh
patent: 6720609 (2004-04-01), Deboer et al.
patent: 6867451 (2005-03-01), Hieda et al.
patent: 2001/0039107 (2001-11-01), Suguro
patent: 2002/0153552 (2002-10-01), Hieda et al.
patent: 2003/0047734 (2003-03-01), Fu et al.
patent: 2004/0048467 (2004-03-01), Marsh
Wolf et al., “Silicon Processing for the VLSI Era vol. 1: Process Technology”, Lattice Press, 1986, pp. 160-175.

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