Structure and manufacturing process of localized shunt to...

Details Structure and manufacturing process of localized shunt to... Structure and manufacturing process of localized shunt to...

2006-10-03

2006-10-03

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C257SE21585

Reexamination Certificate

active

07115502

ABSTRACT:
A method and structure to reduce electromigration failure of semiconductor interconnects. In various embodiments, the area around a via is selectively doped with metallic dopants. The method and resulting structure reduce electromigration failure without adding unnecessary, performance-degrading resistance.

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