Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S194000, C438S285000, C438S574000, C438S775000, C438S777000

Reexamination Certificate

active

07135416

ABSTRACT:
A method of manufacturing a semiconductor device including a gallium nitride related semiconductor. The method include preparing a substrate having surface of a gallium nitride related semiconductor; contacting the surface with atomic nitrogen, which is obtained by decomposing a nitrogen-containing gas in a catalytic reaction, to nitride the surface; and forming, on the surface, a gate electrode and source and drain electrodes opposing each other across the gate electrode.

REFERENCES:
patent: 5766695 (1998-06-01), Nguyen et al.
patent: 6303473 (2001-10-01), Heffernan et al.
patent: 6592771 (2003-07-01), Yamanaka et al.
patent: 6762083 (2004-07-01), Lee et al.
patent: 2001/0040246 (2001-11-01), Ishii
patent: 2004/0144991 (2004-07-01), Kikkawa
patent: 2004/0192043 (2004-09-01), Makita et al.
patent: 2005/0090032 (2005-04-01), Kim et al.
patent: 2005/0136627 (2005-06-01), Melas
patent: 6-244409 (1994-09-01), None
Spruytte, Sylvia G.; MBE Growth on Nitride-Arsenide Materials for Long Wavelength Optoelectronics; Dec. 3, 1999; MRS Internet J. Nitride Semicond. Res. 5S1, W8.4 (2000).
Vaudo, R. P.; Atomic-nitrogen production in a radio-frequency plasma source; Nov. 1, 1993; Optical Society of America, Optics Letter; vol. 18, No. 21.
Blant, A. V.; Nitrogen species from radio frequency plasma sources used for molecular beam epitaxy growth of GaN; Sep. 3, 1999; Plasma Sources Sci. Technol. 9 (2000) 12-17.
T. Hashizume, “Chemical and electronic properties of GaN and AlGaN Surfaces,”Tech. Report of IEICE, Oct. 2002, pp. 1-6,The Institute of Electronics, Information and Communication Engineers, Japan.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3669370

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.