Reducing gate dielectric material to form a metal gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S592000, C257SE21212, C257SE21279, C257SE21290

Reexamination Certificate

active

07144783

ABSTRACT:
In a metal gate replacement process, a cup-shaped gate metal oxide dielectric may have vertical portions that may be exposed to a reduction reaction. As a result of the reduction reaction, the vertical portions may be converted to metal, which adds to the existing gate electrode. In some cases, removing the vertical dielectric portions reduces fringe capacitance and may also advantageously slightly increased underdiffusion without adding heat, in some embodiments.

REFERENCES:
patent: 4557036 (1985-12-01), Kyuragi et al.
patent: 5904517 (1999-05-01), Gardner et al.
patent: 6300202 (2001-10-01), Hobbs et al.
patent: 2004/0118697 (2004-06-01), Wen et al.
patent: 2005/0048791 (2005-03-01), Brask et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reducing gate dielectric material to form a metal gate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reducing gate dielectric material to form a metal gate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reducing gate dielectric material to form a metal gate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3667586

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.