Method to print photoresist lines with negative sidewalls

Details Method to print photoresist lines with negative sidewalls Method to print photoresist lines with negative sidewalls

2006-11-07

2006-11-07

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Electron beam imaging

C430S311000, C430S328000, C430S330000, C430S942000

Reexamination Certificate

active

07132221

ABSTRACT:
It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed by flood exposing with electrons. Then, a second development treatment is given. This results in removal of additional material from the sidewalls, said removal being greatest at the substrate and least at the pedestal's top surface, resulting in negatively sloping sidewalls. Application of this method to a process for forming a pole tip for a vertical magnetic writer is also discussed.

REFERENCES:
patent: 4238559 (1980-12-01), Feng et al.
patent: 5310626 (1994-05-01), Fernandes et al.
patent: 5725997 (1998-03-01), Kamijima
patent: 6255035 (2001-07-01), Minter et al.
patent: 6504675 (2003-01-01), Shukh et al.
Chemistry of a Chemically Amplified Negative Resist and Process Modification for Electron Beam Exposure, by Shigeki Yamamoto et al; Presented by Patrick Martons, Sumitomo Chemical America.
Perpendicular Recording Head Technology, DASCOM Business Group, TDK Corp., Japan, Jul. 23, 2002, p. 5.
“Bake Condition Effect on Hybrid Lithography Process for Negative Tone Chemically Amplified Resists”, by L.Pain et al., Advances in Resist Technology and Processing XVII, Francis M. Houlihan, Editor, Proc. of SPIE, vol. 3999 (2000) ,0277-786 x /00.

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