Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-08-15
2006-08-15
Le, Hoa Van (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C549S014000
Reexamination Certificate
active
07090961
ABSTRACT:
A high resolution resist material comprising an acid generator is provided so that high sensitivity and high resolution for high energy rays of 300 nm or less, small line-edge roughness, and excellence in heat stability and storage stability are obtained. Moreover, a pattern formation method using this resist material are provided. Specifically, a novel compound of the following general formula (1); and a positive resist material comprising this compound preferably as a photo acid generator, and a base resin; are provided. This positive resist material may contain a basic compound or a dissolution inhibitor. Further, the present invention provides a pattern formation method comprising the steps of applying this positive resist material on a substrate, then heat-treating the material, exposing the treated material to a high energy ray having a wavelength of 300 nm or less via a photo mask, optionally heat-treating the exposed material, and developing the material using a developer.
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Abstract of US 20040072097 on pp. 2-5 of Search Report on Nov. 30, 2005.
Azuma, T., et al. “Line edge roughness of chemically amplified resists.”Advances in Resist Technology and Processing XVII3999:264-269 (2000).
Kobayashi Katsuhiro
Kobayashi Tomohiro
Nishi Tsunehiro
Ohsawa Youichi
Watanabe Satoshi
Le Hoa Van
Myers Bigel & Sibley Sajovec, PA
Shin-Etsu Chemical Co. , Ltd.
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