Deposition method with improved step coverage

Details Deposition method with improved step coverage Deposition method with improved step coverage

1999-03-23

2000-04-04

Quach, T. N.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

438637, 438761, H01L 2128

Patent

active

060460970

ABSTRACT:
A deposition method for improving the step coverage of contact holes is disclosed. The method includes initially placing a semiconductor substrate on a chuck of a chamber, wherein the substrate has some contact holes. The chuck is firstly adjusted and conductive material is firstly deposited onto the substrate, wherein the direction of the first deposition is about vertical to the surface of the substrate, and therefore the bottom of the contact holes is then substantially deposited with the conductive material. Next, the chuck is secondly adjusted so that it has a tilt angle between the direction of the second deposition and rotation axis of the chuck. Finally, the chuck is continuously rotated and the conductive material is secondly deposited onto the substrate, and therefore the sidewall of the contact holes is then substantially deposited with the conductive material.

REFERENCES:
patent: 4337115 (1982-06-01), Ikeda et al.
patent: 5084412 (1992-01-01), Nakasaki
patent: 5525158 (1996-06-01), Tsukazaki et al.
patent: 5529634 (1996-06-01), Miyata et al.
patent: 5561326 (1996-10-01), Ito et al.
patent: 5824562 (1998-10-01), Park et al.

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