Method of forming a silica insulation film with a reduced...

Details Method of forming a silica insulation film with a reduced... Method of forming a silica insulation film with a reduced...

2006-06-06

2006-06-06

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S780000, C438S790000, C438S638000

Reexamination Certificate

active

07056839

ABSTRACT:
The invention provides an insulator having a main component of silicon dioxide, wherein the insulator includes at least one kind of organic polymer such as benzene nucleuses distributed therein in order to reduce a dielectric constant thereof as well as a method of forming the same.

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