Method of fabricating dual voltage MOS transistors

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438221, 438225, 438299, H01L 218234

Patent

active

060339586

ABSTRACT:
A method of forming dual voltage MOS transistors includes first forming a mask layer, covering one of the at least two device regions and exposing another one of the two device regions. A gate oxide layer is then formed by thermal oxidation on the exposed device region. After removing the mask layer and exposing another gate oxide formed therebeneath, polysilicon gates for both of the two device regions can be formed.

REFERENCES:
patent: 5432114 (1995-07-01), O
patent: 5502009 (1996-03-01), Lin
patent: 5506159 (1996-04-01), Enomoto
patent: 5716863 (1998-02-01), Arai
patent: 5888873 (1999-03-01), Krivokapic

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating dual voltage MOS transistors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating dual voltage MOS transistors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating dual voltage MOS transistors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-362426

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.