Semiconductor packages and leadframe assemblies

Details Semiconductor packages and leadframe assemblies Semiconductor packages and leadframe assemblies

2006-08-15

2006-08-15

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S678000, C257S704000, C257S787000, C257S731000, C257S666000, C257SE23001

Reexamination Certificate

active

07091596

ABSTRACT:
Semiconductor packages provide a leadframe for packages that are singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respective predetermined package body sizes. The mold caps and leadframe are singulated to the respective predetermined package body sizes.

REFERENCES:
patent: 6608366 (2003-08-01), Fogelson et al.

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