Fishing – trapping – and vermin destroying
Patent
1994-02-07
1995-05-30
Picardat, Kevin M.
Fishing, trapping, and vermin destroying
437182, 437183, 437189, 437190, 437193, H01L 2144
Patent
active
054200733
ABSTRACT:
This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. This is achieved by sequentially deposited a layer of non-noble metal, a layer of titanium, a layer of molybdenum, and a layer of noble or relatively less noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.
REFERENCES:
patent: Re27934 (1974-03-01), Merrin
patent: 1658713 (1928-02-01), Fuller
patent: 2847331 (1958-08-01), Ashley
patent: 3060557 (1962-10-01), Rostoker
patent: 3226822 (1966-01-01), Budde
patent: 3633076 (1972-01-01), Nurnberg
patent: 4017890 (1977-04-01), Howard
patent: 4105828 (1978-08-01), Borchert
patent: 4463059 (1984-07-01), Bhattacharya
patent: 4464441 (1984-08-01), Pikorz
patent: 4772523 (1988-09-01), Mace
patent: 4880684 (1989-11-01), Boss
patent: 4970570 (1990-11-01), Agarwala
patent: 4985310 (1991-01-01), Agarwala
patent: 5057454 (1991-10-01), Yoshida et al.
patent: 5059553 (1991-10-01), Berndlmaier et al.
patent: 5084415 (1992-01-01), Manocha et al.
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5187120 (1993-02-01), Wang
patent: 5232873 (1993-08-01), Geva et al.
patent: 5266522 (1993-11-01), DiGiacomo et al.
patent: 5298459 (1994-03-01), Arikawa et al.
patent: 5310699 (1994-05-01), Chikawa et al.
Research Disclosure, Jul. 1986, No. 26726 (N. Hamilton) Backside Preparation and Metallization of Silicon Wafers for Die-Bonding.
U.S. Patent Application Ser. No. 968,930, filed Oct. 30, 1992 "Interconnect Structure Having Improved Metallization".
DiGiacomo Giulio
Kim Jung-Ihl
Narayan Chandrasekhar
Purushothaman Sampath
Ahsan Aziz M.
International Business Machines - Corporation
Picardat Kevin M.
LandOfFree
Structure and method for a superbarrier to prevent diffusion bet does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structure and method for a superbarrier to prevent diffusion bet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for a superbarrier to prevent diffusion bet will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-361595