Process for treating solid surface and substrate surface

Details Process for treating solid surface and substrate surface Process for treating solid surface and substrate surface

2006-04-11

2006-04-11

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Gas phase etching of substrate

Etching inorganic substrate

C216S075000, C216S076000, C134S002000, C134S003000, C134S009000, C134S021000, C134S022100, C438S706000

Reexamination Certificate

active

07025896

ABSTRACT:
Ruthenium, osmium and their oxides can be etched simply and rapidly by supplying an atomic oxygen-donating gas, typically ozone, to the aforementioned metals and their oxides through catalysis between the metals and their oxides, and the ozone without any damages to wafers and reactors and application of the catalysis not only to the etching but also to chamber cleaning ensures stable operation of reactors and production of high quality devices.

REFERENCES:
patent: 5254217 (1993-10-01), Maniar et al.
patent: 5624583 (1997-04-01), Tokashiki et al.
patent: 5888857 (1999-03-01), Zhang et al.
patent: 5972722 (1999-10-01), Visokay et al.
patent: 6537461 (2003-03-01), Nakahara et al.
patent: 6613242 (2003-09-01), Nakahara et al.
patent: 6659111 (2003-12-01), Mouri et al.
patent: 6673262 (2004-01-01), Mori et al.
patent: 2001/0006245 (2001-07-01), Yunogami et al.
patent: 2001/0023701 (2001-09-01), Aoki et al.
patent: 6-283438 (1994-10-01), None
patent: 7-157832 (1995-06-01), None
patent: 8-78396 (1996-03-01), None
patent: 9-246214 (1997-09-01), None
R. Loessberg, et al., “Eine Methode zur Synthese von wasserfreiem Ruthenium (VIII)-oxid”, in Zeitschriff Fuer Naturforschung, Section B, chemical Sciences, vol. 16B, No. 3, 1981, p. 395.
Patent Abstracts of Japan, Pub. No. 08-153707 (Jun. 11, 1996).

Affiliated with

Also associated with

Rating

Process for treating solid surface and substrate surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for treating solid surface and substrate surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for treating solid surface and substrate surface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3610120