Optoelectronic semiconductor component

Details Optoelectronic semiconductor component Optoelectronic semiconductor component

2006-03-07

2006-03-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S678000, C257S081000, C257S099000, C257S100000

Reexamination Certificate

active

07009285

ABSTRACT:
An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.

REFERENCES:
patent: 5130761 (1992-07-01), Tanaka
patent: 6376902 (2002-04-01), Arndt
patent: D478877 (2003-08-01), Hoshiba
patent: 6717256 (2004-04-01), Suzuki et al.
patent: 2004/0223339 (2004-11-01), Tsuei et al.
patent: 2005/0077532 (2005-04-01), Ota et al.
patent: 315528 (1997-09-01), None

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