Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-03-14
2006-03-14
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S127000
Reexamination Certificate
active
07011989
ABSTRACT:
A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.
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Becker Karl-Friedrich
Böttcher Lars
Braun Tanja
Jung Erik
Koch Mathias
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung
Greenberg Laurence A.
Kebede Brook
Locher Ralph E.
Stemer Werner H.
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