4. Thermal measuring and testing
  5. Temperature measurement
  6. In spaced noncontact relationship to specimen

Mathias Koch

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Method for producing encapsulated chips

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Optical path improvement, focus length change compensation,...

Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
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Segmented cold plate for rapid thermal processing (RTP) tool...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
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Segmented cold plate for rapid thermal processing (RTP) tool...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2759154

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