Chemical mechanical polishing slurry containing abrasive...

Details Chemical mechanical polishing slurry containing abrasive... Chemical mechanical polishing slurry containing abrasive...

2006-07-04

2006-07-04

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S693000, C438S696000, C438S700000

Reexamination Certificate

active

07071108

ABSTRACT:
There is provided a method of manufacturing a semiconductor device, including irradiating a chemical mechanical polishing slurry with light on applying a chemical mechanical polishing treatment using the slurry to a polishing section of a target substrate to be polished, the slurry containing a dispersion medium and abrasive particles dispersed in the dispersion medium and exhibiting a photocatalytic function upon irradiation with light.

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Product Information, TRITON® D-16 Surfactant.
SURFYNOL®, http://www.chunghan.chem.co.kr/eng—surfynol.htm.
Hiroyuki Yano, et al., “Aqueous Dispersion, Aqueous Dispersion for Chemical Mechanical Polishing Used for Manufacture of Semiconductor Devices, Method for Manufacture of Semiconductor Devices, and Method for Formation of Embedded Wiring”, U.S. Appl. No. 09/531,163, filed Mar. 17, 2000.
Notification of Reasons for Rejection issued by the Japanese Patent Office, mailed Oct. 18, 2005, for Japanese Patent Application No. 2002-089951, and English-language translation thereof.

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