Non-volatile semiconductor memory device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S257000, C257S315000

Reexamination Certificate

active

07101749

ABSTRACT:
A non-volatile semiconductor memory device according to the present invention has a semiconductor substrate and a memory cell having a floating gate provided through a tunnel insulating layer on the semiconductor substrate, and a control gate provided through an inter-layer insulting layer on said floating gate. The inter-insulating layer includes a silicon oxide layer contiguous to said floating gate, a first silicon nitride layer provided by a CVD method on the silicon oxide layer and a second silicon nitride layer provided on said first silicon nitride layer and having a lower trap density than that of the first silicon nitride layer. The inter-insulating layer may includes a silicon oxide layer contiguous to said floating gate and a silicon oxide layer deposited on said silicon oxide layer and having a quantity of hydrogen content on the order of 1019/cm3or less. The inter-insulating layer also may includes a silicon oxide layer serving as a layer contiguous to at least one of the floating gate and the control gate, and having a lower trap density than that of a silicon nitride layer formed by a CVD method.

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Wang, et al., “Dual Frequency Silicon Nitride Low Thermal Budget for Pre-Metal Dielectric Applications in Sub-0.25 μm Devices,” IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 1999, pp. 405-408.
Klein, et al., “Silicon Nitride PECVD at Low Temperature: Film Properties Plasma Physics,” IEEE Plasma Science 25thAnniversary, Jun. 4, 1998, p. 215.

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