Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-03-21
2006-03-21
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S117000, C438S615000, C029S760000, C029S025010, C228S044700, C228S049500, C269S104000, C269S119000, C269S246000, C269S305000, C269S315000, C269S118000, C269S903000
Reexamination Certificate
active
07015066
ABSTRACT:
A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.
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Chen Ken
Huang Chender
Tsao Pei-Haw
Wang Jones
Graybill David E.
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Assoc.
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