Method and apparatus for generating trenches for vias

Details Method and apparatus for generating trenches for vias Method and apparatus for generating trenches for vias

2006-07-11

2006-07-11

Smith, Matthew (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C257S774000

Reexamination Certificate

active

07076750

ABSTRACT:
A method of checking a computer generated circuit layout involves selecting vias with at least an edge coincident to an edge of a metal line. Once vias are selected, based upon whether a via touches an edge of a metal line, information regarding the distance between metal lines is determined. Metal lines are resized in the vicinity of a via with an edge touching an edge of a metal line in order to effect a complete connection between the metal line and the via in a manufactured integrated circuit taking into account the information regarding the distance between metal lines. Resized metal lines do not impact metal lines adjacent to the edge that a via was touching because adjacent metal lines are resized to account for a too small separation distance if necessary.

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