Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2006-09-12
2006-09-12
Chen, Bret (Department: 1762)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C438S710000, C438S720000, C438S722000
Reexamination Certificate
active
07105101
ABSTRACT:
A dry cleaning process for removing native oxide at improved efficiency is disclosed. The dry cleaning process minimizes the amount of fluorine atoms absorbed on the surface of a processed substrate. Fluorine radicals are provided to the substrate together with hydrogen radicals. The substrate is processed by the reaction of the fluorine radicals and the hydrogen radicals.
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Aoyama Shintaro
Shinriki Hiroshi
Chen Bret
Crowell & Moring LLP
Tokyo Electron Limited
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