Method for manufacturing semiconductor device, including...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S301000, C438S275000

Reexamination Certificate

active

07026205

ABSTRACT:
A semiconductor device manufacturing method having forming first and second insulating gate portions spaced from each other on a semiconductor substrate, selectively implanting the first conductivity type impurity ions to the first gate electrode and a surface layer of the semiconductor substrate adjacent to the first insulating gate portion, selectively implanting the second conductivity type impurity ions to the second gate electrode and the surface layer adjacent to the second insulating gate portion, after implanting the first and second conductivity types impurity ions, pre-annealing at a first substrate temperature, and after the pre-annealing, main-activating for the first and second types impurity ions at a second substrate temperature higher than the first substrate temperature for a treatment period shorter than a period of the pre-annealing.

REFERENCES:
patent: 5837572 (1998-11-01), Gardner et al.
patent: 6512273 (2003-01-01), Krivokapic et al.
patent: 6777752 (2004-08-01), Osanai et al.
patent: 2004/0018702 (2004-01-01), Ito et al.
patent: 06-069149 (1994-03-01), None
patent: 2002-246329 (2002-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing semiconductor device, including... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, including..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device, including... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3571449

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.