Semiconductor memory device

Details Semiconductor memory device Semiconductor memory device

2006-01-31

2006-01-31

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S311000, C257S905000, C257S906000

Reexamination Certificate

active

06992343

ABSTRACT:
A semiconductor memory device is provided which can achieve the high integration, ultra-high speed operation, and significant reduction of power consumption during the information holding time, by reducing the increase in the area of a memory cell and obtaining a period of the ultra-high speed readout time and ensuring a long refresh period at the time of the self refresh. A DRAM employing a one-intersection cell·two cells/bit method has a twin cell structure employing a one-intersection 6F2cell, the structure in which: memory cells are arranged at positions corresponding to all of the intersections between a bit-line pair and a word line; and when a half pitch of the word line is defined as F, a pitch of each bit line of the bit-line pair is larger than 2F and smaller than 4F. Further, an active region in the silicon substrate, on which a source, channel and drain of the transistor of each memory cell are formed, is obliquely formed relative to the direction of the bit-line pair.

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