Semiconductor device power distribution system and method

Details Semiconductor device power distribution system and method Semiconductor device power distribution system and method

2006-01-03

2006-01-03

Thai, Luan (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S123000

Reexamination Certificate

active

06982220

ABSTRACT:
An integrated circuit power distribution system and method is provided. The integrated circuit comprises a semiconductor die that includes at least one pair of bond pads having a single bond wire connected thereto such that each bond pad of the pair of bond pads has only one bond wire end connected thereto. A first bond pad of the pair of bond pads is located in an internal portion of the semiconductor die. A first wire having a first end and a second end is electrically connected between the pair of bond pads.

REFERENCES:
patent: 4359754 (1982-11-01), Hayakawa et al.
patent: 4403240 (1983-09-01), Seki et al.
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5838072 (1998-11-01), Li et al.
patent: 5869870 (1999-02-01), Lin
patent: 5905639 (1999-05-01), Warren
patent: 5960262 (1999-09-01), Torres et al.
patent: 5986345 (1999-11-01), Monnot
patent: 5989939 (1999-11-01), Fjelstad
patent: 6025616 (2000-02-01), Nguyen et al.
patent: 6043539 (2000-03-01), Sigasawara
patent: 6091140 (2000-07-01), Toh et al.
patent: 6097098 (2000-08-01), Ball
patent: 6107681 (2000-08-01), Lin
patent: 6144093 (2000-11-01), Davis et al.
patent: 6169331 (2001-01-01), Manning et al.
patent: 6211565 (2001-04-01), Yu
patent: 6246113 (2001-06-01), Lin
patent: 6424223 (2002-07-01), Wang et al.

Affiliated with

Also associated with

Rating

Semiconductor device power distribution system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device power distribution system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device power distribution system and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3545320