Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2006-03-28
2006-03-28
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S005000
Reexamination Certificate
active
07018271
ABSTRACT:
The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal. Each intensity measurement corresponds to a sampling zone in the path across the substrate surface. A radial position is determined for each sampling zone, and the intensity measurements are divided into a plurality of radial ranges according to the radial positions. The layer thickness is computed for each radial range from the intensity measurements associated with that radial range.
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Schoenleber Walter
Swedek Boguslaw
Wiswesser Andreas Norbert
Applied Materials Inc.
Fish & Richardson
Wilson Lee D.
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