Semiconductor memory device with cap structure and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S304000, C257S327000, C257S618000

Reexamination Certificate

active

07019349

ABSTRACT:
A semiconductor memory device includes a trench capacitor formed in a major surface portion of a semiconductor substrate. The trench capacitor includes a storage node electrode provided within a trench formed in the major surface portion of substrate, a plate electrode disposed opposed to the storage node electrode, and a capacitor insulation film provided between the storage node electrode and plate electrode and formed of high-dielectric-constant material. The memory device further includes an insulated-gate field-effect transistor formed in the major surface portion of substrate, a contact portion that electrically connects a source or drain of the IGFET and the storage node electrode, and a cap structure formed between the contact portion and upper parts of the storage node electrode.

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M. Gutsche, et al., “Capacitance Enhancement Techniques for Sub-100nm Trench DRAMs”, IEEE, 2001.
J. Lee, et al., “mass Production Worthy HfO2-Al2O3Laminate Capacitor Technology Using Hf Liquid Precursor for Sub-100hm DRAMs”, IEEE, 2002.
H. Seidl, et al., “A Fully Integrated Al2O3Trench Capacitor DRAM for Sub-100nm Technology”, IEEE, 2002.

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