Semiconductor chip package having a semiconductor chip with...

Details Semiconductor chip package having a semiconductor chip with... Semiconductor chip package having a semiconductor chip with...

2005-02-15

2005-02-15

Karlsen, Ernest (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S124000, C257S790000, C257S778000, C257S692000, C257S680000, C174S050510, C174S260000

Reexamination Certificate

active

06855575

ABSTRACT:
A method for manufacturing a semiconductor chip package includes: preparing a semiconductor chip having center and edge bonding pads and a substrate, which includes a first window, a second window, connection pads, external terminal pads, and a wiring pattern; attaching the semiconductor chip on the substrate such that the first window exposes the center bonding pads and the second window exposes the edge bonding pads; connecting the first and second bonding pads to corresponding connection pads; encapsulating side surfaces of the semiconductor chip, a portion of the bottom surface of the substrate, the bonding wires, and the connection pads; and forming external terminals on the external terminal pads of the substrate. The encapsulating includes a first encapsulation of the side surfaces of the semiconductor chip and a portion of the bottom surface of the substrate and a second encapsulation of the bonding wires and the connection pads.

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