Method of fabricating a semiconductor device that includes...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S596000

Reexamination Certificate

active

06969655

ABSTRACT:
Methods of fabricating semiconductor devices are disclosed. An example method may include providing a substrate including an active region and a non-active region and forming a first gate electrode comprising a dielectric layer pattern, a first conducting layer pattern, and a first insulating layer pattern, the first gate electrode functioning as a flash memory. The example method may also include forming spacers on sidewalls of the first gate electrode; forming a second gate electrode comprising a gate oxide, a second conducting layer pattern, and a second insulating layer pattern, the second gate electrode functioning as a normal gate electrode; and removing a residual conducting layer on one sidewall of the spacer.

REFERENCES:
patent: 6001688 (1999-12-01), Rizzuto
patent: 6165845 (2000-12-01), Hsieh et al.
patent: 6232185 (2001-05-01), Wang
patent: 6284596 (2001-09-01), Sung et al.
patent: 6348378 (2002-02-01), Lee
patent: 6455440 (2002-09-01), Jeng
patent: 6589842 (2003-07-01), Huang
patent: 6642116 (2003-11-01), Lin
patent: 2002-026159 (2002-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a semiconductor device that includes... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a semiconductor device that includes..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a semiconductor device that includes... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3500254

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.