Manufacturing a conformal atomic liner layer in an...

Details Manufacturing a conformal atomic liner layer in an... Manufacturing a conformal atomic liner layer in an...

2005-12-06

2005-12-06

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S627000, C438S656000

Reexamination Certificate

active

06972254

ABSTRACT:
A manufacturing method for an integrated circuit has a substrate with a semiconductor device thereon. A channel dielectric layer is deposited over the device and has an opening provided therein. A reducing process is performed in order to reduce the oxidation on the conductor and a conformal atomic liner is deposited in an atomic layer thickness to line the opening in the channel dielectric layer. A barrier layer is deposited over the conformal atomic liner and a seed layer is deposited over the barrier layer. A conductor core layer is deposited on the seed layer, filling the opening over the barrier layer and connecting to the semiconductor device.

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