Formation of solder balls having resin member as reinforcement

Details Formation of solder balls having resin member as reinforcement Formation of solder balls having resin member as reinforcement

2005-05-24

2005-05-24

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE23021

Reexamination Certificate

active

06897142

ABSTRACT:
A method of forming a solder ball includes the steps of forming an electrode pad on a substrate, forming an insulating layer having a first opening at a position of the electrode pad, filling the first opening with solder paste that include solder and first resin, and applying a heating process to the solder paste so as to form a solder ball on the electrode pad and to form a cured resin member of the first resin across a border between the electrode pad and the substrate.

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Hirobumi Nakamura, “Solder Paste,” Japan Patent Office, Sep. 1996, English translation of JP 08-174264 A.*
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URL: Fujitsu Co., Ltd., “Fujitsu Develops Advanced Printing Bump Technology,” [online], Dec. 12, 2001, InternetURL:http//pr.fujitsu.com/jp
ews/2001/12/12-1.html.
S. Sakuyama, et al., “Solder Bumping Technology for Wafer-scale Packaging”, 7thSymposium on “Microjoining and Assembly Technology in Electronics”, Micro-Contact Research Committee, Feb. 1, 2001, p. 285-290, (English Abstract).

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